TEM (Transmission electron microscope)
Transmission Electron Microscopy (TEM) and Scanning Transmission Electron Microscopy (STEM)
Transmission Electron Microscopy (TEM) and Scanning Transmission Electron Microscopy (
Although more time consuming than many other common analytical tools, the wealth of information available from these experiments is impressive. Not only can you obtain outstanding image resolution, it is also possible to characterize crystallographic phase, crystallographic orientation (both by diffraction mode experiments), produce elemental maps (using EDS), and images that highlight elemental contrast (dark field mode)—all from nm sized areas that can be precisely located. STEM and TEM can be the ultimate failure analysis tools for thin film and IC samples.
S/TEM Technical Capabilities
Signal Detected:
Transmitted electrons, scattered electrons, x-rays
Elements Detected:
B-U (EDS)
Detection Limits:
0.1 - 1%
Imaging/Mapping:
Yes (EDS)
Ultimate Lateral Resolution:
<0.2 nm
Ideal Uses for S/TEM Analysis
- Identification of nm sized defects on integrated circuits, including embedded particles and residues at the bottom of vias.
- Determination of crystallographic phases as a function of distance from an interface.
- Nanoparticle characterization: Core/shell investigations, agglomeration, effects of annealing…
- Catalyst support coverage.
- Ultra small area elemental maps.
- III-V super lattice characterization
Relevant Industries for S/TEM Analysis
- Compound Semiconductors
- Intergrated circuit
- Magnetic media
- Nanomaterials
- MEMS
- Opto-electronics
- Semiconductors
Strengths of S/TEM Analysis
- The ultimate elemental mapping resolution of any analytical technique.
- Sub 0.2 nm image resolution.
- Small area crystallographic information
Limitations of S/TEM Analysis
- Significant sample preparation time
- Samples are often prepared that are <100nm
- Some materials not stable to electron beam